Маркировка чипов памяти и наклейка на модулях памяти Samsung DDR3 SDRAM - как расшифровывается

1. – Память SAMSUNG – Memory (K)

2. – DRAM - (4)

3. – тип DRAM
В – DDR3 SDRAM

4 – Плотность - Density
51 – 512Mb

1G – 1Gb

2G – 2Gb

4G – 4Gb

5. – Битовая организация - Bit Organization
04 – x4

08 – x8

16 – x16

6. - # of Internal Banks
3 – 4 Banks

4 – 8 Banks

5 – 16 Banks

7. – Напряжения питания - Interface, VDD, VDDQ
6 – SSTL (1.5V, 1.5V)

8. Ревизия – (Поколение – Generation)

M – 1st Gen.

A – 2nd Gen.

В – 3rd Gen.

С – 4th Gen.

D – 5th Gen.

E – 6th Gen.

F – 7th Gen.

G – 8th Gen.

H – 9th Gen.

9 – Корпусировка – Package

Z – FBGA (без свинца)

H – FBGA (без свинца и галогенов)

J – FBGA (без свинца, DDP)

M – FBGA (без свинца и галогенов, DDP)

10. – Temperature & Power (VDD)
С – Commercial Temp. ( 0°C ~ 85°C) & Normal Power

L – Commercial Temp. ( 0°C ~ 85°C) & Low Power

Y – Commercial Temp. ( 0°C ~ 85°C) & Low VDD(1.35V)

11. – Скорость - Speed
F7 – DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F8 – DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9 – DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 – DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

1. – Модуль памяти – Memory Module – M

2. – DIMM Type

3 – DIMM

4 – SODIMM

3. – Биты Данных - Data Bits
71 – x64 204pin Unbuffered SODIMM

78 – x64 240pin Unbuffered DIMM

91 – x72 240pin ECC unbuffered DIMM

92 – x72 240pin VLP Registered DIMM

93 – x72 240pin Registered DIMM

4. DRAM Component Type

В : DDR3 SDRAM (1.5V VDD)

5. - Depth

32 – 32M 33 – 32M (for 128Mb/512Mb)

64 – 64M 65 – 64M (for 128Mb/512Mb)

28 – 128M 29 –128M (for 128Mb/512Mb)
56 – 256M 57 – 256M (for 512Mb/2Gb)
51 – 512M 52 – 512M (for 512Mb/2Gb)
1G – 1G 1K – 1G (for 2Gb)
2G – 2G 2K – 2G (for 2Gb)

6. # of Banks in comp. & Interface

7 – 8 Banks&SSTL - 1.5V

7. – Битовая организация - Bit Organization

0 – x4

3 – x8

4 – x16

8. - Ревизия - Component Revision

M – 1st Gen.

В – 3rd Gen.

D – 5th Gen.

F – 7th Gen.

A – 2nd Gen.

С – 4th Gen.

E – 6th Gen.

G – 8th Gen.

9 – Корпусировка – Package

Z – FBGA (без свинца)

H – FBGA (без свинца и галогенов)

J – FBGA (без свинца, DDP)

M – FBGA (без свинца и галогенов, DDP)

10. – Ревизия печатной платы - PCB Revision

0 – None

1 – 1st Rev.

2 – 2nd Rev.

3 – 3rd Rev.

4 – 4th Rev.

11. - Температура и питание - Temp & Power

С – Commercial Temp. ( 0°C ~ 85°C) & Normal Power

L – Commercial Temp. ( 0°C ~ 85°C) & Low Power

Y – Commercial Temp. ( 0°C ~ 85°C) & Low VDD(1.35V)

12. - Скорость - Speed

F7 – DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F8 – DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9 – DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 – DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

Примечание:

PC3-6400(DDR3-800),

PC3-8500(DDR3-1066),

PC3-10600(DDR3-1333),

PC3-12800(DDR3-1600)